Applications and Industries : Abrasives
Applications and Industries : Abrasives
Applications and Industries
Abrasives
Bettersize instruments provide the particle size distribution and particle shape analysis of silicon carbide, garnet, diamond, corundum and aluminum oxide.
As we can see abrasives are widely used and it is the "teeth" of the manufacturing industry. Silicon carbide powder is a type of milling material mainly used for multi-wire cutting machines, and its particle shape and particle size are vital for the degree of smoothness and cutting efficiency of silicon wafers. Silicon carbide powder is the essence of silicon wafer cutting. With an appropriate particle shape, the surface of the silicon wafers presents a good degree of smoothness after cutting. Cutting efficiency can be improved by narrowing the particle size distribution and making the corner angle sharper.
There are 3 properties of materials which determine their ability to function as abrasives - Hardness, Sharpness and Toughness. Their hardness and sharpness reduce surfaces and their toughness is to withstand the abrading action. The surface being treated must have a hardness lower than the selected abrasive. A high hardness is necessary to grind, polish or remove surface.
Materials used as abrasives include garnet, diamond, silicon carbide and aluminum oxide.
Particle size is an integral part of the proper selection and use of an abrasive. Traditionally, the measurements have been made by sieves. However, sieve measurements are limited in capability to measure very small sizes and are subject to shape bias only measuring the second largest dimension. Sizes for abrasives have a range from 6 millimeters to as small as 6 micrometers.
The shape of the particles is important to the effectiveness of the abrading action.
Sharpness is an indicator of the ability of a material to remove material from another surface. Asperity (roughness of the surface) affects wear rate of the under-treatment surface and effectiveness of the abrasive. The wear rate decreases below a certain abrasive particle size. The sharpness is determined by procedures such as the SPQ (Spike Parameter Quadratic) calculation, but with the Bettersize DIA system it is possible to measure the angularity of a particle which is far superior to using the Krumbein method.
Angularity may provide a better indication of sharpness than Krumbein. This is because angularity takes into account all pointed edges for particles, which is lacking in the Krumbein method.
BeVision W1
BeVision W1 is a high-resolution dynamic image particle size and shape analysis machine. Based on sheath flow theory, BeVision W1 particle size distribution analyser can capture each particle and deliver accurate image data. BeVision W1 particle analyzer is the best solution for scientific research and quality control.
BeVision S1
The BeVision S1 offers an easy solution to measure and analyze the size and shape of particles in a range of 1 - 3,000 µm. It is easy to use while staying reliable and accurate. The BeVision software offers 24 different particle size and shape parameters and further organizes the data into an all-around validation of particles. The BeVision S1 is not only a reliable independent particle size and shape analyzer, but it can also be a perfect match for laser diffraction particle analyzers, as an aid or a verification.
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Bettersizer 2600
The Bettersizer 2600 utilizes this laser diffraction technology. There are 92 photoelectric detectors to convert light signals from the scattering spectrum to electrical signals, which are transmitted into an intelligent software. By implementing the Mie scattering theory to the data and performing mathematical conversion, the complete particle size distribution can be derived.
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